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Do you know The preparing process of multilayer PCB manufacturing material?


The aim of multilayer PCB manufacturing material preparing process

If you have know the stress of multilayer PCB laminated, you will understand the aim of multilayer PCB manufacturing material preparing process more clear.
Because the layer after pressing except stress is very important for its lifetime. This point may confuse by most new hands of PCB designer.
So HTD circuits want to more guys to know that better multilayer PCB manufacturing material preparing process, longer life time it is.
The preparing for multilayer PCB manufacturing material process is one step completely not omitted.

The first step of multilayer PCB manufacturing material preparing

Produce multilayer prototypes in complete take out after.
The multilayer PCB manufacturing material can through hot, cold, cut or milling off.
All those PCB manufacturing method should be flashing in the oven.
Because most of time the stress of the PCB manufacturing material have changed when the flash in the oven.

The second step of multilayer PCB manufacturing material preparing

We have know the stress of multilayer PCB manufacturing material will be changed when it flash in the oven.
But how to measure the stress or how to make the decision to finish preparing process?
From our decades PCB experts, flat baked 4 hours, 150 degrees Celsius to release the stress gradually in the plate and resin curing.
This is a very important step for multilayer PCB board.
Because this factor not only relate to its lifetime, but also affect its performance.
Do you know The preparing process of multilayer PCB manufacturing material, mail to info@htdcircuits.com for additional info

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