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Multi-layer thickness and tolerance


Multi-layer boardscome in a variety of finished thicknesses with one of the most common finished thickness being 0.062”.

The following chart provides a breakdown of stack up thickness and tolerance levels for 2-6 layer boards. 

Should you require specifications for boards greater than 6 layers, please contact us. 

Standard 2 Layer PCB Construction (0.062")


Thickness
(Inches)
Tolerance (+/-)
Layer 1 
0.0017 0.0004 0.5 oz foil plated to approximate*
Laminate Core 0.0580 0.0005 Dielectric Constant 4.5 (+/- 0.10)
Layer 2 0.0017 0.0004 0.5 oz foil plated to approximate*
Overall: 0.061 0.006

* Plating target is minimum of 0.0008" in the hole with approximately 0.001" on the surface. Design can influence the plated thickness, generally thinner on Ground planes and thicker on signals.


Multilayer Printed Circuit Board Stackups

The following multilayer printed circuit board stackups are the standard constructions for PCBexpress quickturn products and the 1 oz thickness Full Feature Product.

Standard 4 Layer PCB Construction (0.062")

Thickness (Inches)
Tolerance (+/-) 
Layer 1 0.0017 0.0004 0.5 oz foil plated to approximate*
Bonding ply
(1 x 7628, 2 x 1080)
0.0119 0.0010 Dielectric Constant 4.5 (+/- 0.10)
Layer 2 0.0014
0.0004 1 oz. foil
Laminate Core 0.0280 0.0025 Dielectric Constant 4.5 (+/- 0.10)
Layer 3 0.0014 0.0004 1 oz. foil
Bonding ply
(1 x 7628, 2 x 1080)
0.0119 0.0010 Dielectric Constant 4.5 (+/- 0.10)
Layer 4 0.0017 0.0004 0.5 oz foil plated to approximate*
Overall: 0.0580 0.0061

* Plating target is minimum of 0.0008" in the hole with approximately 0.001" on the surface. Design can influence the plated thickness, generally thinner on Ground planes and thicker on signals.

Standard 6 Layer PCB Construction (0.062")

Thickness (inches) 
Tolerance (+/-)
Layer 1 0.0017 0.0004 0.5 oz foil plated to approximate*
Bonding ply
(1 x 2116, 1 x 1080)
0.0064 0.0007 Dielectric Constant 4.5 (+/- 0.10)
Layer 2 0.0014 0.0004 1.0 oz foil thickness
Laminate Core 0.014 0.002 Dielectric Constant 4.5 (+/- 0.10)
Layer 3 0.0014 0.0004 1 oz. foil thickness
Bonding ply
(2 x 2116)
0.0084 0.0008 Dielectric Constant 4.5 (+/- 0.10)
Layer 4 0.0014 0.0004 1 oz. foil thickness
Laminate Core 0.014 0.002 Dielectric Constant 4.5 (+/- 0.10)
Layer 5 0.0014 0.0004 1.0 oz foil thickness
Bonding ply
(1 x 2116, 1 x 1080)
0.0064 0.0007 Dielectric Constant 4.5 (+/- 0.10)
Layer 6 0.0017 0.0004 0.5 oz foil plated to approximate*
Overall 0.0582 0.0086

* Plating target is minimum of 0.0008" in the hole with approximately 0.001" on the surface. Design can influence the plated thickness, generally thinner on Ground planes and thicker on signals. For orders of more than 6 layers PCB manufacture, please contact customer support.

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